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2019-10-23arm: dts: k3-j721e-main: Add UFS nodesFaiz Abbas
Add TI UFS glue layer and Cadence UFS Host controller DT nodes. Signed-off-by: Faiz Abbas <faiz_abbas@ti.com>
2019-10-11arm: dts: k3-j721e-main: Add C71x DSP nodeLokesh Vutla
The J721E SoCs have a single TMS320C71x DSP Subsystem in the MAIN voltage domain containing the next-generation C711 CPU core. The subsystem has 32 KB of L1D configurable SRAM/Cache and 512 KB of L2 configurable SRAM/Cache. This subsystem has a CMMU but is not used currently. The inter-processor communication between the main A72 cores and the C711 processor is achieved through shared memory and a Mailbox. Add the DT node for this DSP processor sub-system in the common k3-j721e-main.dtsi file. Signed-off-by: Suman Anna <s-anna@ti.com> Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-10-11arm: dts: k3-j721e-main: Add C66x DSP nodesLokesh Vutla
The J721E SoCs have two TMS320C66x DSP Core Subsystems (C66x CorePacs) in the MAIN voltage domain, each with a C66x Fixed/Floating-Point DSP Core, and 32 KB of L1P & L1D configurable SRAMs/Cache and an additional 288 KB of L2 configurable SRAM/Cache. These subsystems do not have an MMU but contain a Region Address Translator (RAT) sub-module for translating 32-bit processor addresses into larger bus addresses. The inter-processor communication between the main A72 cores and these processors is achieved through shared memory and Mailboxes. Add the DT nodes for these DSP processor sub-systems in the common k3-j721e-main.dtsi file. Signed-off-by: Suman Anna <s-anna@ti.com> Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-10-11arm: dts: k3-j721e-main: Add MAIN domain R5F cluster nodesLokesh Vutla
The J721E SoCs have 3 dual-core Arm Cortex-R5F processor (R5FSS) subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within the MCU domain, and the remaining two clusters are present in the MAIN domain (MAIN_R5FSS0 & MAIN_R5FSS1). Each of these can be configured at boot time to be either run in a LockStep mode or in an Asymmetric Multi Processing (AMP) fashion in Split-mode. These subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal memories for each core split between two banks - ATCM and BTCM (further interleaved into two banks). There are some IP integration differences from standard Arm R5 clusters such as the absence of an ACP port, presence of an additional TI-specific Region Address Translater (RAT) module for translating 32-bit CPU addresses into larger system bus addresses etc. Add the DT nodes for these two MAIN domain R5F cluster/subsystems, the two R5 cores are each added as child nodes to the corresponding main cluster node. Configure SS0 in split mode an SS1 in lockstep mode, with the ATCMs enabled to allow the R5 cores to execute code from DDR with boot-strapping code from ATCM. Signed-off-by: Suman Anna <s-anna@ti.com> Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-07-26arm: dts: ti: Add Support for J721E SoCLokesh Vutla
Add initial SoC definition for J721E SoC. Kernel dts posted here: https://lore.kernel.org/lkml/20190522161921.20750-1-nm@ti.com/ Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>