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Bringing in the MMC tree means that CONFIG_BOUNCE_BUFFER needed to be
added to include/configs/exynos5-dt.h now.
Conflicts:
include/configs/exynos5250-dt.h
Signed-off-by: Tom Rini <trini@ti.com>
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When variable size SPL is used, the BL1 expects the SPL to be
encapsulated differently: instead of putting the checksum at a fixed
offset in the SPL blob, prepend the blob with a header including the
size and the checksum.
The enhancements include
- adding a command line option, '--vs' to indicate the need for the
variable size encapsulation
- padding the fixed size encapsulated blob with 0xff instead of random
memory contents
- do not silently truncate the input file, report error instead
- no need to explicitly closing files/freeing memory, this all happens
on exit; removing cleanups it makes code clearer
- profuse commenting
- modify Makefile to allow enabling the new feature per board
Signed-off-by: Vadim Bendebury <vbendeb@chromium.org>
Signed-off-by: Rajeshwari S Shinde <rajeshwari.s@samsung.com>
Acked-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Minkyu Kang <mk7.kang@samsung.com>
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Convert like follows:
CPU mpc83xx -> CONFIG_MPC83xx
CPU mpc85xx -> CONFIG_MPC85xx
CPU mpc86xx -> CONFIG_MPC86xx
CPU mpc5xxx -> CONFIG_MPC5xxx
CPU mpc8xx -> CONFIG_8xx
CPU mpc8260 -> CONFIG_8260
CPU ppc4xx -> CONFIG_4xx
CPU x86 -> CONFIG_X86
ARCH x86 -> CONFIG_X86
ARCH powerpc -> CONFIG_PPC
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Some editors such as Emacs can highlight source files.
But their parser algorithm is not perfect.
If you use one double-quotation alone, some editor cannot
handle it nicely and mark source lines as a string by mistake.
It is preferable to use two double-quotations as a pair.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Freescale DDR driver has been used for mpc83xx, mpc85xx, mpc86xx SoCs.
The similar DDR controllers will be used for ARM-based SoCs.
Signed-off-by: York Sun <yorksun@freescale.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Simon Glass <sjg@chromium.org>
Acked-by: Simon Glass <sjg@chromium.org>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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We have converted all makefiles needed to build $(LIBS).
Until this commit we used to grep switch so that U-Boot style
and Kbuild style makefiles coexist.
But we do not need any more.
Goint forward, use always Kbuild style Makefile when adding
a new Makefile
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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This patch moves S5PC, EXYNOS specific directory entries
from the toplevel Makefile to arch/arm/cpu/armv7/Makefile
using Kbuild descending feature.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Minkyu Kang <mk7.kang@samsung.com>
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This patch moves OMAP specific directory entries
from the toplevel Makefile and spl/Makefile
to arch/arm/cpu/armv7/Makefile using Kbuild descending feature.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Tom Rini <trini@ti.com>
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This patch moves Tegra specific directory entries
from the toplevel Makefile and spl/Makefile
to arch/arm/cpu/*/Makefile using Kbuild descending feature.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Tom Warren <TWarren@nvidia.com>
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Multiple targets are included in arch/arm/imx-common/Makefile
In order to refactor it,
we need to tweak Makefile and spl/Makefile.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Every makefile in sub directories has common lines
at the top and the bottom.
This commit pushes the common parts into script/Makefile.build.
Going forward sub-makefiles only need to describe this part:
COBJS := ...
COBJS += ...
SOBJS := ...
But using obj-y is preferable to prepare for switching to Kbuild.
The conventional (non-Kbuild) Makefile style is still supported.
This is achieved by greping the Makefile before entering into it.
U-Boot conventional sub makefiles always include some other makefiles.
So the build system searches a line beginning with "include" keyword
in the makefile in order to distinguish which style it is.
If the Makefile include a "include" line, we assume it is a conventional
U-Boot style. Otherwise, it is treated as a Kbuild-style makefile.
With this tweak, we can switch sub-makefiles
from U-Boot style to Kbuild style little by little.
obj-y := foo/
syntax (descending into the sub directory) is not supportd yet.
It will be implemented in the upcomming commit.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Simon Glass <sjg@chromium.org>
Cc: Tom Rini <trini@ti.com>
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We may need to access the PMIC code in SPL, when we have power set.
Signed-off-by: Tom Rini <trini@ti.com>
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Signed-off-by: Heiko Schocher <hs@denx.de>
Cc: Tom Rini <trini@ti.com>
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Due to the nand SPL on some board(e.g. P1022DS)has a size limit, it can
not be more than 4K. So, the SPL cannot initialize the DDR with the SPD
code. This patch introduces TPL to enable a loader stub that is loaded
by the code from the SPL. It initializes the DDR with the SPD or other
operations.
The TPL's size is sizeable, the maximum size is decided by the memory's
size that TPL runs. It initializes the DDR through SPD code, and copys
final uboot image to DDR. So there are three stage uboot images:
* spl_boot, * tpl_boot, * final uboot image
Signed-off-by: Ying Zhang <b40530@freescale.com>
Acked-by: York Sun <yorksun@freescale.com>
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The code from the internal on-chip ROM. It loads the final uboot image
into DDR, then jump to it to begin execution.
The SPL's size is sizeable, the maximum size must not exceed the size of L2
SRAM. It initializes the DDR through SPD code, and copys final uboot image
to DDR. So there are two stage uboot images:
* spl_boot, 96KB size. The env variables are copied to L2 SRAM, so that
ddr spd code can get the interleaving mode setting in env. It loads
final uboot image from offset 96KB.
* final uboot image, size is variable depends on the functions enabled.
Signed-off-by: Ying Zhang <b40530@freescale.com>
Acked-by: York Sun <yorksun@freescale.com>
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SPL defines CONFIG_SPL_BUILD but this does not percolate to the
autoconf.mk Makefile. As a result the build breaks when
CONFIG_SPL_BUILD is used in the board-specific include header file. With
this, there is a possibility of having a CONFIG option defined in the
header file but not defined in the Makefile causing all kinds of build
failure and problems.
It also messes things for up, for example, when one might want to
undefine options to keep the SPL small and doesn't want to be stuck with
the CONFIG options used for U-boot. Lastly, this also avoids defining
special CONFIG_SPL_ variables for cases where some options are required
in U-boot but not in SPL.
We add a spl-autoconf.mk rule that is generated for SPL with the
CONFIG_SPL_BUILD flag and conditionally include it for SPL builds.
Signed-off-by: Joel Fernandes <joelf@ti.com>
Signed-off-by: Ying Zhang <b40530@freescale.com>
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Adding a new CONFIG_OMAP_COMMON which is included by all boards
that needs to build cpu/armv7/omap-common folder.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
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Signed-off-by: Wolfgang Denk <wd@denx.de>
[trini: Fixup common/cmd_io.c]
Signed-off-by: Tom Rini <trini@ti.com>
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Conflicts:
spl/Makefile
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This requires that cpu_is_exynos4/5 should be made available before tzpc_init.
Hence this patch also makes necessary changes to have cpu_info in spl and
invokes arch_cpu_init before tzpc_init in low_level_init.S for smdk5250.
Signed-off-by: Inderpal Singh <inderpal.singh@linaro.org>
Acked-by: Chander Kashyap <chander.kashyap@linaro.org>
Signed-off-by: Minkyu Kang <mk7.kang@samsung.com>
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Signed-off-by: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
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Allow usage of the imx-common/iomux-v3.h framework by including pad settings for
the i.MX35. The content of the file is taken from Linux kernel at commit
267dd34, plus the required changes to make it work in U-Boot.
Signed-off-by: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
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Fix minor adjustments needed to get SPL framework building on MX5.
Signed-off-by: Marek Vasut <marex@denx.de>
Cc: Albert ARIBAUD <albert.u.boot@aribaud.net>
Cc: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
Cc: Scott Wood <scottwood@freescale.com>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Tom Rini <trini@ti.com>
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This patch moves the following functions into the imx-common
directory:
- mxs_wait_mask_set()
- mxs_wait_mask_clr()
- mxs_reset_block()
These are currently used by i.MX28. But the upcoming GPMI NAND port
for i.MX6 will also use these functions. So lets move them to a
common location to re-use them.
Signed-off-by: Stefan Roese <sr@denx.de>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Marek Vasut <marex@denx.de>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
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Add TI814X EVM board directory, config file, and MAINTAINERS
entry. Enable build.
Signed-off-by: Matt Porter <mporter@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
[trini: Adapt to recent omap_hsmmc requirements, Matt re-tested]
Signed-off-by: Tom Rini <trini@ti.com>
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Many SPL linker scripts needlessly include linker lists (aka LGAs).
Remove them whenever possible; keep it only in the seven am335x_evm
variants (am335x_evm, am335x_evm_uart[1-5], am335x_evm_spiboot),
where there is actual content in output section .u_boot_list.
This commit keeps all u-boot.bin and u-boot-spl.bin in ARM targets
byte-identical.
Signed-off-by: Albert ARIBAUD <albert.u.boot@aribaud.net>
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In case of usbeth booting just call net_load_image("usb_ether").
This patch also adds CONFIG_SPL_USBETH_SUPPORT and
CONFIG_SPL_MUSB_NEW_SUPPORT config options to enable linking of SPL
against USB gagdet support and new MUSB driver resp.
Signed-off-by: Ilya Yanok <ilya.yanok@cogentembedded.com>
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The '#' used as comments in the files cause the preprocessor
trouble, so change to /* */.
The mkimage command which uses this preprocessor output
was moved to arch/arm/imx-common/Makefile
.gitignore was updated to ignore .cfgtmp files.
Signed-off-by: Troy Kisky <troy.kisky@boundarydevices.com>
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This patch adds basic Tegra30 (T30) build support - no specific
board is targeted.
Signed-off-by: Tom Warren <twarren@nvidia.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
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Conflicts:
README
board/samsung/universal_c210/universal.c
drivers/misc/Makefile
drivers/power/power_fsl.c
include/configs/mx35pdk.h
include/configs/mx53loco.h
include/configs/seaboard.h
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The toplevel makefile hardcodes this stuff, so spl/Makefile needs to as well.
Signed-off-by: Scott Wood <scottwood@freescale.com>
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Signed-off-by: Stefano Babic <sbabic@denx.de>
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Add MLO.byteswap as a target to spl/Makefile and un-guard the first MLO
rule so we don't have to duplicate it.
Signed-off-by: Tom Rini <trini@ti.com>
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This patch adds essential components for generation of the contents of
the linker section that is used by the linker-generated array. All of
the contents is held in a separate file, u-boot.lst, which is generated
at runtime just before U-Boot is linked.
The purpose of this code is to especially generate the appropriate
boundary symbols around each subsection in the section carrying the
linker-generated arrays. Obviously, the interim linker code for actual
placement of the variables into the section is generated too. The
generated file, u-boot.lst, is included into u-boot.lds via the linker
INCLUDE directive in u-boot.lds .
Adjustments are made in the Makefile and spl/Makefile so that the
u-boot.lds and u-boot-spl.lds depend on their respective .lst files.
Signed-off-by: Marek Vasut <marex@denx.de>
Cc: Joe Hershberger <joe.hershberger@gmail.com>
Cc: Mike Frysinger <vapier@gentoo.org>
Acked-by: Joe Hershberger <joe.hershberger@ni.com>
Tested-by: Joe Hershberger <joe.hershberger@ni.com>
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patches.
Move files that are going to be common between T20 and T30 into 'tegra-common'
subdirs in AVP (arm720t), CPU (armv7), and shared (arch/arm/cpu/.) areas. Any
files that are left behind in '/tegra20' will be copied to '/tegra30' subdirs
and modified for that SoC. The 'common' files should need only minor changes.
Include files (arch/arm/include/asm/arch-tegra/tegra20) will be done in a
follow-on patch.
Builds fine w/MAKEALL -s tegra20. Checkpatch.pl is clean.
Signed-off-by: Tom Warren <twarren@nvidia.com>
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This patch adds support for networking in SPL. Some devices are
capable of loading SPL via network so it makes sense to load the
main U-Boot binary via network too. This patch tries to use
existing network code as much as possible. Unfortunately, it depends
on environment which in turn depends on other code so SPL size
is increased significantly. No effort was done to decouple network
code and environment so far.
Signed-off-by: Ilya Yanok <ilya.yanok@cogentembedded.com>
Acked-by: Joe Hershberger <joe.hershberger@ni.com>
Signed-off-by: Tom Rini <trini@ti.com>
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Add a new flag, CONFIG_SPL_FRAMEWORK to opt into the common/spl SPL
framework, enable on all of the previously using boards. We move the
spl_ymodem.c portion to common/ and spl_mmc.c to drivers/mmc/. We leave
the NAND one in-place as we plan to replace it later in this series.
We use common/spl to avoid linker problems with respect to merging
constant strings in objects. Otherwise all strings in common/ will be
linked in and kept which grows SPL in size too much.
Signed-off-by: Tom Rini <trini@ti.com>
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Remove linker command line options from the SPL makefile
that force the inclusion of unreferenced command code from
linked object files. As commands are not used in the SPL,
these options resulted in an unnecessary increase in the
image size, in addition to introducing the possibility of
tricky link errors in the case where the command code
contained symbols that were not resolved by linking in the
limited objects compiled in the SPL build.
Signed-off-by: Tyler Olmstead <tyler.j.olmstead@gmail.com>
Acked-by: Tom Rini <trini@ti.com>
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This fixes the SPL build to link with the SPL version of libgcc if
USE_PRIVATE_LIBGCC is set to "yes". Previously it was linking with
the libgcc from the normal u-boot build because it gets set in
PLATFORM_LIBS and passed down the to the SPL build.
Signed-off-by: Allen Martin <amartin@nvidia.com>
Acked-by: Stephen Warren <swarren@wwwdotorg.org>
Tested-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Tom Warren <twarren@nvidia.com>
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In preparation for splitting out the armv4t code from tegra20, move
the tegra20 SoC code to arch/arm/cpu/tegra20-common. This code will
be compiled armv4t for the arm7tdmi and armv7 for the cortex A9.
Signed-off-by: Allen Martin <amartin@nvidia.com>
Acked-by: Stephen Warren <swarren@wwwdotorg.org>
Tested-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Tom Warren <twarren@nvidia.com>
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