Merge branch 'master' of git://git.denx.de/u-boot-arm

1 files changed, 225 insertions, 1 deletions

diff --git a/include/ddr_spd.h b/include/ddr_spd.h
index 15a3e8d351..cf2aac6ae4 100644
--- a/include/ddr_spd.h
+++ b/include/ddr_spd.h
@@ -1,5 +1,5 @@
 /*
- * Copyright 2008 Freescale Semiconductor, Inc.
+ * Copyright 2008-2014 Freescale Semiconductor, Inc.
  *
  * This program is free software; you can redistribute it and/or
  * modify it under the terms of the GNU General Public License
@@ -290,11 +290,220 @@ typedef struct ddr3_spd_eeprom_s {
 
 } ddr3_spd_eeprom_t;
 
+/* From JEEC Standard No. 21-C release 23A */
+struct ddr4_spd_eeprom_s {
+	/* General Section: Bytes 0-127 */
+	uint8_t info_size_crc;		/*  0 # bytes */
+	uint8_t spd_rev;		/*  1 Total # bytes of SPD */
+	uint8_t mem_type;		/*  2 Key Byte / mem type */
+	uint8_t module_type;		/*  3 Key Byte / Module Type */
+	uint8_t density_banks;		/*  4 Density and Banks	*/
+	uint8_t addressing;		/*  5 Addressing */
+	uint8_t package_type;		/*  6 Package type */
+	uint8_t opt_feature;		/*  7 Optional features */
+	uint8_t thermal_ref;		/*  8 Thermal and refresh */
+	uint8_t oth_opt_features;	/*  9 Other optional features */
+	uint8_t res_10;			/* 10 Reserved */
+	uint8_t module_vdd;		/* 11 Module nominal voltage */
+	uint8_t organization;		/* 12 Module Organization */
+	uint8_t bus_width;		/* 13 Module Memory Bus Width */
+	uint8_t therm_sensor;		/* 14 Module Thermal Sensor */
+	uint8_t ext_type;		/* 15 Extended module type */
+	uint8_t res_16;
+	uint8_t timebases;		/* 17 MTb and FTB */
+	uint8_t tck_min;		/* 18 tCKAVGmin */
+	uint8_t tck_max;		/* 19 TCKAVGmax */
+	uint8_t caslat_b1;		/* 20 CAS latencies, 1st byte */
+	uint8_t caslat_b2;		/* 21 CAS latencies, 2nd byte */
+	uint8_t caslat_b3;		/* 22 CAS latencies, 3rd byte */
+	uint8_t caslat_b4;		/* 23 CAS latencies, 4th byte */
+	uint8_t taa_min;		/* 24 Min CAS Latency Time */
+	uint8_t trcd_min;		/* 25 Min RAS# to CAS# Delay Time */
+	uint8_t trp_min;		/* 26 Min Row Precharge Delay Time */
+	uint8_t tras_trc_ext;		/* 27 Upper Nibbles for tRAS and tRC */
+	uint8_t tras_min_lsb;		/* 28 tRASmin, lsb */
+	uint8_t trc_min_lsb;		/* 29 tRCmin, lsb */
+	uint8_t trfc1_min_lsb;		/* 30 Min Refresh Recovery Delay Time */
+	uint8_t trfc1_min_msb;		/* 31 Min Refresh Recovery Delay Time */
+	uint8_t trfc2_min_lsb;		/* 32 Min Refresh Recovery Delay Time */
+	uint8_t trfc2_min_msb;		/* 33 Min Refresh Recovery Delay Time */
+	uint8_t trfc4_min_lsb;		/* 34 Min Refresh Recovery Delay Time */
+	uint8_t trfc4_min_msb;		/* 35 Min Refresh Recovery Delay Time */
+	uint8_t tfaw_msb;		/* 36 Upper Nibble for tFAW */
+	uint8_t tfaw_min;		/* 37 tFAW, lsb */
+	uint8_t trrds_min;		/* 38 tRRD_Smin, MTB */
+	uint8_t trrdl_min;		/* 39 tRRD_Lmin, MTB */
+	uint8_t tccdl_min;		/* 40 tCCS_Lmin, MTB */
+	uint8_t res_41[60-41];		/* 41 Rserved */
+	uint8_t mapping[78-60];		/* 60~77 Connector to SDRAM bit map */
+	uint8_t res_78[117-78];		/* 78~116, Reserved */
+	int8_t fine_tccdl_min;		/* 117 Fine offset for tCCD_Lmin */
+	int8_t fine_trrdl_min;		/* 118 Fine offset for tRRD_Lmin */
+	int8_t fine_trrds_min;		/* 119 Fine offset for tRRD_Smin */
+	int8_t fine_trc_min;		/* 120 Fine offset for tRCmin */
+	int8_t fine_trp_min;		/* 121 Fine offset for tRPmin */
+	int8_t fine_trcd_min;		/* 122 Fine offset for tRCDmin */
+	int8_t fine_taa_min;		/* 123 Fine offset for tAAmin */
+	int8_t fine_tck_max;		/* 124 Fine offset for tCKAVGmax */
+	int8_t fine_tck_min;		/* 125 Fine offset for tCKAVGmin */
+	/* CRC: Bytes 126-127 */
+	uint8_t crc[2];			/* 126-127 SPD CRC */
+
+	/* Module-Specific Section: Bytes 128-255 */
+	union {
+		struct {
+			/* 128 (Unbuffered) Module Nominal Height */
+			uint8_t mod_height;
+			/* 129 (Unbuffered) Module Maximum Thickness */
+			uint8_t mod_thickness;
+			/* 130 (Unbuffered) Reference Raw Card Used */
+			uint8_t ref_raw_card;
+			/* 131 (Unbuffered) Address Mapping from
+			      Edge Connector to DRAM */
+			uint8_t addr_mapping;
+			/* 132~253 (Unbuffered) Reserved */
+			uint8_t res_132[254-132];
+			/* 254~255 CRC */
+			uint8_t crc[2];
+		} unbuffered;
+		struct {
+			/* 128 (Registered) Module Nominal Height */
+			uint8_t mod_height;
+			/* 129 (Registered) Module Maximum Thickness */
+			uint8_t mod_thickness;
+			/* 130 (Registered) Reference Raw Card Used */
+			uint8_t ref_raw_card;
+			/* 131 DIMM Module Attributes */
+			uint8_t modu_attr;
+			/* 132 RDIMM Thermal Heat Spreader Solution */
+			uint8_t thermal;
+			/* 133 Register Manufacturer ID Code, LSB */
+			uint8_t reg_id_lo;
+			/* 134 Register Manufacturer ID Code, MSB */
+			uint8_t reg_id_hi;
+			/* 135 Register Revision Number */
+			uint8_t reg_rev;
+			/* 136 Address mapping from register to DRAM */
+			uint8_t reg_map;
+			/* 137~253 Reserved */
+			uint8_t res_137[254-137];
+			/* 254~255 CRC */
+			uint8_t crc[2];
+		} registered;
+		struct {
+			/* 128 (Loadreduced) Module Nominal Height */
+			uint8_t mod_height;
+			/* 129 (Loadreduced) Module Maximum Thickness */
+			uint8_t mod_thickness;
+			/* 130 (Loadreduced) Reference Raw Card Used */
+			uint8_t ref_raw_card;
+			/* 131 DIMM Module Attributes */
+			uint8_t modu_attr;
+			/* 132 RDIMM Thermal Heat Spreader Solution */
+			uint8_t thermal;
+			/* 133 Register Manufacturer ID Code, LSB */
+			uint8_t reg_id_lo;
+			/* 134 Register Manufacturer ID Code, MSB */
+			uint8_t reg_id_hi;
+			/* 135 Register Revision Number */
+			uint8_t reg_rev;
+			/* 136 Address mapping from register to DRAM */
+			uint8_t reg_map;
+			/* 137 Register Output Drive Strength for CMD/Add*/
+			uint8_t reg_drv;
+			/* 138 Register Output Drive Strength for CK */
+			uint8_t reg_drv_ck;
+			/* 139 Data Buffer Revision Number */
+			uint8_t data_buf_rev;
+			/* 140 DRAM VrefDQ for Package Rank 0 */
+			uint8_t vrefqe_r0;
+			/* 141 DRAM VrefDQ for Package Rank 1 */
+			uint8_t vrefqe_r1;
+			/* 142 DRAM VrefDQ for Package Rank 2 */
+			uint8_t vrefqe_r2;
+			/* 143 DRAM VrefDQ for Package Rank 3 */
+			uint8_t vrefqe_r3;
+			/* 144 Data Buffer VrefDQ for DRAM Interface */
+			uint8_t data_intf;
+			/*
+			 * 145 Data Buffer MDQ Drive Strength and RTT
+			 * for data rate <= 1866
+			 */
+			uint8_t data_drv_1866;
+			/*
+			 * 146 Data Buffer MDQ Drive Strength and RTT
+			 * for 1866 < data rate <= 2400
+			 */
+			uint8_t data_drv_2400;
+			/*
+			 * 147 Data Buffer MDQ Drive Strength and RTT
+			 * for 2400 < data rate <= 3200
+			 */
+			uint8_t data_drv_3200;
+			/* 148 DRAM Drive Strength */
+			uint8_t dram_drv;
+			/*
+			 * 149 DRAM ODT (RTT_WR, RTT_NOM)
+			 * for data rate <= 1866
+			 */
+			uint8_t dram_odt_1866;
+			/*
+			 * 150 DRAM ODT (RTT_WR, RTT_NOM)
+			 * for 1866 < data rate <= 2400
+			 */
+			uint8_t dram_odt_2400;
+			/*
+			 * 151 DRAM ODT (RTT_WR, RTT_NOM)
+			 * for 2400 < data rate <= 3200
+			 */
+			uint8_t dram_odt_3200;
+			/*
+			 * 152 DRAM ODT (RTT_PARK)
+			 * for data rate <= 1866
+			 */
+			uint8_t dram_odt_park_1866;
+			/*
+			 * 153 DRAM ODT (RTT_PARK)
+			 * for 1866 < data rate <= 2400
+			 */
+			uint8_t dram_odt_park_2400;
+			/*
+			 * 154 DRAM ODT (RTT_PARK)
+			 * for 2400 < data rate <= 3200
+			 */
+			uint8_t dram_odt_park_3200;
+			uint8_t res_155[254-155];	/* Reserved */
+			/* 254~255 CRC */
+			uint8_t crc[2];
+		} loadreduced;
+		uint8_t uc[128]; /* 128-255 Module-Specific Section */
+	} mod_section;
+
+	uint8_t res_256[320-256];	/* 256~319 Reserved */
+
+	/* Module supplier's data: Byte 320~383 */
+	uint8_t mmid_lsb;		/* 320 Module MfgID Code LSB */
+	uint8_t mmid_msb;		/* 321 Module MfgID Code MSB */
+	uint8_t mloc;			/* 322 Mfg Location */
+	uint8_t mdate[2];		/* 323~324 Mfg Date */
+	uint8_t sernum[4];		/* 325~328 Module Serial Number */
+	uint8_t mpart[20];		/* 329~348 Mfg's Module Part Number */
+	uint8_t mrev;			/* 349 Module Revision Code */
+	uint8_t dmid_lsb;		/* 350 DRAM MfgID Code LSB */
+	uint8_t dmid_msb;		/* 351 DRAM MfgID Code MSB */
+	uint8_t stepping;		/* 352 DRAM stepping */
+	uint8_t msd[29];		/* 353~381 Mfg's Specific Data */
+	uint8_t res_382[2];		/* 382~383 Reserved */
+
+	uint8_t user[512-384];		/* 384~511 End User Programmable */
+};
+
 extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd);
 extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd);
 extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd);
 extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd);
 extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd);
+unsigned int ddr4_spd_check(const struct ddr4_spd_eeprom_s *spd);
 
 /*
  * Byte 2 Fundamental Memory Types.
@@ -310,6 +519,7 @@ extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd);
 #define SPD_MEMTYPE_DDR2_FBDIMM	(0x09)
 #define SPD_MEMTYPE_DDR2_FBDIMM_PROBE	(0x0A)
 #define SPD_MEMTYPE_DDR3	(0x0B)
+#define SPD_MEMTYPE_DDR4	(0x0C)
 
 /* DIMM Type for DDR2 SPD (according to v1.3) */
 #define DDR2_SPD_DIMMTYPE_UNDEFINED	(0x00)
@@ -338,4 +548,18 @@ extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd);
 #define DDR3_SPD_MODULETYPE_16B_SO_DIMM	(0x0C)
 #define DDR3_SPD_MODULETYPE_32B_SO_DIMM	(0x0D)
 
+/* DIMM Type for DDR4 SPD */
+#define DDR4_SPD_MODULETYPE_MASK	(0x0f)
+#define DDR4_SPD_MODULETYPE_EXT		(0x00)
+#define DDR4_SPD_MODULETYPE_RDIMM	(0x01)
+#define DDR4_SPD_MODULETYPE_UDIMM	(0x02)
+#define DDR4_SPD_MODULETYPE_SO_DIMM	(0x03)
+#define DDR4_SPD_MODULETYPE_LRDIMM	(0x04)
+#define DDR4_SPD_MODULETYPE_MINI_RDIMM	(0x05)
+#define DDR4_SPD_MODULETYPE_MINI_UDIMM	(0x06)
+#define DDR4_SPD_MODULETYPE_72B_SO_UDIMM	(0x08)
+#define DDR4_SPD_MODULETYPE_72B_SO_RDIMM	(0x09)
+#define DDR4_SPD_MODULETYPE_16B_SO_DIMM	(0x0C)
+#define DDR4_SPD_MODULETYPE_32B_SO_DIMM	(0x0D)
+
 #endif /* _DDR_SPD_H_ */